Pulse energy, repetition rate, pulse width
NS-FH-10641064 nm near-infrared pulsed laser
1064 nmNS-FH-1064 is a 1064 nm Pulsed laser. Used for sapphire marking, ceramic cutting, semiconductor cutting, film scribing. Cooling: Water cooled. Key specifications: pulse energy 200 uJ, repetition rate 0.2-10 MHz, pulse width 2-10 ns @1.5 MHz. View specifications, datasheet and enquiry options from Precisometer.
Specifications
NS-FH-1064
24 specification rows
| Pulse energy | 200 uJ |
|---|---|
| Repetition rate | 0.2-10 MHz |
| Pulse width | 2-10 ns @1.5 MHz |
| Beam / notes | Cooling: Water cooled |
| pulse | duration, / high |
| Ave power stability (rms, 4 hours±3℃) | <2%, <1% |
| Warm-up time (minutes) | <10 |
| Transverse mode | TEM00 |
| Beam divergence, full angle (mrad) | <1 |
| M2 | <1.3 |
| Polarization ratio | >100:1 Vertical |
| Cooled method | Water cooled |
| Operating temperature (℃) | 15-35 |
| Power supply (100-240VAC) | RAD1PS |
| Expected lifetime (hours) | >10000 |
| Wavelength (nm) | 1064±1 |
| Average power (W) | 1-60 |
| Single pulse energy (uJ) | 200μJ@200kHz；60μJ@1MHz；40μJ@1.5MHz |
| Rep. Rate | 0.2-10MHz |
| Pulse duration (ns) | 2-10ns@1.5MHz |
| Peak power (MW) | 1-20 |
| Beam diameter at the aperture (1/e2,mm) | <3 |
| M² | <1.3 |
| Beam height from base plate (mm) | 114 |
Applications
Uses named on this model’s datasheet.
- Sapphire marking
- Ceramic cutting
- Semiconductor cutting
- Film scribing
- Physics experiment
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