Pulse energy, repetition rate, pulse width
PS-D-355-Water355 nm UV pulsed laser
355 nmPS-D-355-Water is a 355 nm Pulsed laser. Used for glass marking, sapphire marking, ceramic cutting, semiconductor cutting. Key specifications: output / average power 1~2000 mW, pulse energy 1~2000 nJ, repetition rate 0.4-2 MHz. View specifications, datasheet and enquiry options from Precisometer.
Specifications
PS-D-355-Water
22 specification rows
| Output / average power | 1~2000 mW |
|---|---|
| Pulse energy | 1~2000 nJ |
| Repetition rate | 0.4-2 MHz |
| Pulse width | ~10 ps |
| Power stability (rms, 4 hours ± 3°C) | <2%, <1% |
| Transverse mode | TEM00 |
| Beam divergence, full angle (mrad) | <2 |
| M2 | <1.2 |
| Polarization ratio | >100:1 Horizontal (Vertical optional) |
| Warm-up time (minutes) | ≥30 |
| Operating temperature (℃) | 20-30 |
| Cooling method | Water cooled |
| Operating voltage (VDC) | 36V/40A |
| Expected lifetime (hours) | >10000 |
| Wavelength (nm) | 355±1 |
| Output power (mW) | 1-2000@1MHz |
| Rep.rate | 400kHz-10MHz |
| Pulse duration (ps) | ~10 |
| Beam Circularity (%) | >90 |
| M² | <1.2 |
| Beam diameter at the at the aperture (1/e2, mm) | ~2 |
| Beam height from base plate (mm) | 96 |
Applications
Uses named on this model’s datasheet.
- Glass marking
- Sapphire marking
- Ceramic cutting
- Semiconductor cutting
- Solar panel coating
- Film scribing
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