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Basic series

CD0307UV-B Beam Profiler

CD0307UV-B basic series beam profiler. Spectral range: 190-340 nm, 340-1100 nm. Beam-spot range: 34.5 μm-7.1 mm. Check power, attenuation and interface conditions for the selected configuration.

CD0307UV-B beam profiler assembly
CD0307UV-B · mounting and optical configuration depend on the selected assembly.
Spectral range
190-340 nm, 340-1100 nm
Spot range
34.5 μm-7.1 mm
Data interface
USB3.0

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Technical specifications

Compare the listed configurations and match the specifications to your setup.

23 specification rows.

Model specifications

23 entries
CD0307UV-B Beam Profiler: Model specifications
ParameterSpecification
ModelCD0307UV-B
Spectral Range190-340 nm, 340-1100 nm
Dynamic Range73.9 dB
Lowest effective response[1] 1.52μW/cm²@266 nm 0.0965μW/cm²@633 nm 0.434μW/cm²@1064 nm
Sensor size8.4*7.1 mm
Resolution2448*2048
Min. sensor position6 mm
Sensor Pixel Size3.45 μm
Exposure Time0.05 ms-500 ms
ShutterGlobal Shutter
Beam Spot Detection Range34.5 μm-7.1 mm
Max. Power Density (damage threshold)50 W/cm²(with OD3.0 attenuation)
Max. energy density1J/cm²(with OD3.0 attenuation)
Max. Power1 W
AttenuatorOD1.0D/OD20.D/OD3.0D(190-340 nm) OD0.5/OD1/OD2/OD3(340-1100 nm)
Data interfaceUSB3.0
Calculating frame rate5-10 fps [2]
TriggerYes
Structure TypeBack interface, compatible with C-port thread
DimensionSee the outline
Operating EnvironmentTemperature: 0-35°C [3] , relative humidity<60%
Operational ConditionsOperating system: Windows 10/11, 64-bit, pre-installed MS Office or WPS. Hardware: ≥8G RAM, CPU I5 above (≥2.5GHz, Core ≥4), recommended display resolution is 1920*1080.
Weight<500 g

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Configuration notes and measurement conditions

  • [1] The described parameter indicates the lowest effective response when the exposure time is set to 100 milliseconds. [2] The parameter mentioned is the calculating frame rate at a resolution of 5,000,000 pixels. [3] It is the working temperature, if it involves directivity test, the temperature should be controlled at 15-25°C.
  • Read total power, power density and pulse-energy-density limits with the stated attenuation, wavelength, beam size, cooling and detection time.

Mechanical drawings

Mechanical outline and mounting dimensions in millimeters
Mechanical outline · dimensions in mm

From image to measurement

Beam analysis and software

Example false-colour spatial intensity distribution
Two-dimensional intensity map
Example three-dimensional beam intensity profile
Three-dimensional beam profile
Example software views of beam position, transverse intensity and stability
Beam position and transverse analysis

Illustrative software output. Results, analysis functions and acquisition rates depend on the selected hardware, software and beam conditions.

See the spatial distribution

Inspect two-dimensional intensity maps, three-dimensional beam profiles and transverse intensity sections to assess spot shape and alignment.

Follow beam characteristics

Analyse beam diameter, ellipticity and position. Suitable configurations support multi-spot monitoring, image stitching and pointing-stability analysis; acquisition and processing rates are model dependent.

Choose the measurement configuration

Check exposure, shutter and external-trigger support for your timing requirements. The 1000 W system specifies beam analysis and optional automatic M² workflows; these capabilities require the stated software and hardware configuration.

Specify the complete measurement

  1. 01

    Match the wavelength

    Choose the exact detection band and the attenuation or window configuration. A family range combines different models; it does not make every instrument broadband.

  2. 02

    Resolve the spot

    Compare the minimum detectable spot with the maximum usable beam size. Sensor pixel size, optical magnification and quoted measurement resolution describe different quantities. Gaussian TEM00 limits may be smaller than the sensor aperture.

  3. 03

    Check power and exposure

    Read total power, irradiance and pulse-energy-density limits together. Include pulse duration, repetition rate, beam diameter, cooling and the permitted measurement time. Attenuation conditions belong to the quoted limit.

  4. 04

    Plan acquisition and alignment

    Match USB or GigE, trigger support, software requirements and beam-entry geometry. Divergence needs measurements at known axial positions; automated M² analysis requires the appropriate scan hardware and software configuration.

Technical FAQ

Configuration questions for CD0307UV-B

Does the largest model power rating apply to every laser?

No. The rating depends on wavelength, beam diameter, attenuation, cooling and operating time. For example, the 500 W configurations distinguish 200 W, 300 W and 500 W operation by focused-spot size and measurement time. The 1000 W model specifies continuous operation with water cooling.

Is the sensor aperture the maximum Gaussian beam diameter?

Not always. Several models give a smaller TEM00 or 1/e² beam limit than the geometric sensor range. Read the model footnotes and central-incidence conditions alongside the main table.

Can a single camera image measure divergence or M²?

A single profile gives the transverse distribution at one plane. Divergence and M² require measurements along the propagation axis, suitable optics and a defined analysis method. Confirm the translation, attenuation and software configuration for that workflow.

Which computer and interface are required?

Most listed models specify Windows 10 or 11, 64-bit, with MS Office or WPS, at least 8 GB RAM and a processor of at least 2.5 GHz with four or more cores. USB3.0, GigE, 10GigE and trigger availability vary by model; use its exact specification.

Technical documents

Keep the optical, electrical, mechanical and operating specifications together for your configuration.

Datasheet

Match the profiler to your laser

Include wavelength, beam size, CW or pulsed operation, pulse energy, repetition rate, power, exposure time, cooling and the measurements you need.

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