See the spatial distribution
Inspect two-dimensional intensity maps, three-dimensional beam profiles and transverse intensity sections to assess spot shape and alignment.
Microfocus series
CN0310VIS-XVW microfocus series beam profiler. Spectral range: 400-800 nm. Beam-spot range: 5 μm-0.5 mm. Check power, attenuation and interface conditions for the selected configuration.

Compare the details
Compare the listed configurations and match the specifications to your setup.
19 specification rows.
| Parameter | Specification |
|---|---|
| Model | CN0310VIS-XVW |
| Detection Wavelength | 400-800 nm |
| Beam Spot Detection Range | 5 μm-0.5 mm |
| Camera Effective Area | φ5 mm |
| Magnification | 10x |
| Resolution | 0.5 μm |
| Exposure Time | 0.05 ms-500 ms |
| Maximum Power | 0.5 W@minimum focal spot |
| Lowest Effective Response | 0.136μW/cm² [1] |
| Built-in Attenuation | OD0/OD1/OD2/OD3/OD4 |
| Interface | USB3.0 |
| Processing Frame Rate | 5-10 fps [2] |
| External Trigger | Supported |
| Dimensions | Refer to mechanical drawing |
| Beam Input Orientation | Vertical/Horizontal |
| Defocus Range | -1 mm , +1.3 mm |
| Operating Environment | Temperature<0-35°C [3] , relative humidity<60% |
| Operational Conditions | Software environment: Windows 10/11, 64 bit, pre installed with MS Office or WPS, Hardware configuration: ≥8GB memory, CPU clock speed ≥2.5G, core ≥4, recommended i5 or above equivalent models, optimal display resolution 1920 * 1080 |
| Weight | <1.5 Kg |
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From image to measurement



Illustrative software output. Results, analysis functions and acquisition rates depend on the selected hardware, software and beam conditions.
Inspect two-dimensional intensity maps, three-dimensional beam profiles and transverse intensity sections to assess spot shape and alignment.
Analyse beam diameter, ellipticity and position. Suitable configurations support multi-spot monitoring, image stitching and pointing-stability analysis; acquisition and processing rates are model dependent.
Check exposure, shutter and external-trigger support for your timing requirements. The 1000 W system specifies beam analysis and optional automatic M² workflows; these capabilities require the stated software and hardware configuration.
01
Choose the exact detection band and the attenuation or window configuration. A family range combines different models; it does not make every instrument broadband.
02
Compare the minimum detectable spot with the maximum usable beam size. Sensor pixel size, optical magnification and quoted measurement resolution describe different quantities. Gaussian TEM00 limits may be smaller than the sensor aperture.
03
Read total power, irradiance and pulse-energy-density limits together. Include pulse duration, repetition rate, beam diameter, cooling and the permitted measurement time. Attenuation conditions belong to the quoted limit.
04
Match USB or GigE, trigger support, software requirements and beam-entry geometry. Divergence needs measurements at known axial positions; automated M² analysis requires the appropriate scan hardware and software configuration.
Technical FAQ
No. The rating depends on wavelength, beam diameter, attenuation, cooling and operating time. For example, the 500 W configurations distinguish 200 W, 300 W and 500 W operation by focused-spot size and measurement time. The 1000 W model specifies continuous operation with water cooling.
Not always. Several models give a smaller TEM00 or 1/e² beam limit than the geometric sensor range. Read the model footnotes and central-incidence conditions alongside the main table.
A single profile gives the transverse distribution at one plane. Divergence and M² require measurements along the propagation axis, suitable optics and a defined analysis method. Confirm the translation, attenuation and software configuration for that workflow.
Most listed models specify Windows 10 or 11, 64-bit, with MS Office or WPS, at least 8 GB RAM and a processor of at least 2.5 GHz with four or more cores. USB3.0, GigE, 10GigE and trigger availability vary by model; use its exact specification.
Keep the optical, electrical, mechanical and operating specifications together for your configuration.
DatasheetInclude wavelength, beam size, CW or pulsed operation, pulse energy, repetition rate, power, exposure time, cooling and the measurements you need.