Material absorption
Wavelength and pulse width change the interaction regime.
Reveal composition · Spectroscopy & analysis
Laser ablation and LIBS
Set the pulse–material interaction to remove, sample, or identify matter.
Application focusMaterial absorption
Target fluence
Energy and spot size must cross the process threshold.
Thermal footprint
Shorter pulses can reduce heat and collateral damage.
Why the source matters
Material response depends on pulse duration, pulse energy, peak power, spot size, repetition rate, and wavelength absorption.
The correct source is defined at the sample or process—not at the laser aperture. Wavelength and operating mode set the interaction; stability, delivery, timing, and control determine whether it stays useful in the complete system.
Light in1064, 532, 355, 266 nm options
InteractionProbe matter
ResultMaterial absorption
Application workflow
Design from the result backward.
Three decisions turn the application into a practical source specification.
Characterize the material
Identify composition, coating, thickness, absorption, surface condition, and acceptable damage.
Define the interaction
Set fluence, spot size, pulse width, energy, repetition rate, and desired plasma behavior.
Complete the process
Add focusing, scanning, collection timing, debris handling, enclosure, and fixturing.
Selection guide
Match the architecture to the experiment.
These are starting architectures. Precisometer qualifies the final wavelength, output, delivery, control, and integration package against your setup.
- Wavelength band
- 1064, 532, 355, 266 nm options
- Operating mode
- ns, sub-ns, ps, or fs pulsed
LIBS elemental analysis
A nanosecond Q-switched source offers strong plasma generation and timing control.
Precision ablation
Sub-ns, ps, or fs pulses reduce thermal interaction when edge quality matters.
UV-sensitive material
Use 355 or 266 nm to increase absorption and reduce the interaction volume.
Source architecture
Platform families to qualify.
213, 266, 355, 532, 1064 nm and custom
Nanosecond and sub-nanosecond pulsed lasers
For applications controlled by pulse energy, timing, spot size, and peak power.
High peak powerVariable repetition rateAir-cooled formats
266, 355, 515, 532, 1030, 1064, 1560 nm examples
Picosecond and femtosecond lasers
For precision material processing and experiments that need reduced thermal load.
Short pulse durationHigh repetition rateGood beam quality
248-400 nm CW and pulsed options
Deep-UV and high-power UV lasers
For UV absorption, polymer marking, inspection, and fine material processing.
Cold processingSmall heat affected zoneHigh contrast marking
Ready to specify
Bring us the application—not a guessed model number.
Ask for material, target spot size, fluence, pulse width, energy per pulse, repetition rate, and debris or thermal limits.
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