Shortwave Infrared Imaging
Sony SenSWIR InGaAs and deep-cooled domestic InGaAs sensors spanning 400–1700 nm. From compact UAV-ready modules to 1000 fps CameraLink systems and complete SWIR modular microscopes.
Highest-Resolution 400–1700 nm SWIR Camera
The SWIR5000 series delivers 5.0 megapixel resolution across the full 400–1700 nm shortwave infrared band using Sony's flagship IMX992 SenSWIR InGaAs sensor. With 3.45 μm pixels, 51.5 dB dynamic range, and frame rates up to 165 fps (10GigE), it is the top choice for high-resolution SWIR machine vision, material sorting, and industrial inspection. Available with built-in TEC (KMA), external TEC (KMB), or compact no-TEC UMV variants.
SWIR light penetrates materials opaque to visible light — including silicon, plastics, and biological tissue — enabling non-destructive inspection, in vivo imaging, moisture mapping, and night-vision observation beyond the capability of standard cameras.

Comprehensive Specifications
Sony SenSWIR InGaAs sensors. KMA = built-in TEC (25°C drop). KMB = external TEC (10°C drop). UMV = compact uncooled.
| Parameter | SWIR5000 Series | SWIR3000 Series | SWIR1300 Series | SWIR330 Series |
|---|---|---|---|---|
| Image Sensor | Sony IMX992 (SenSWIR InGaAs, GS) | Sony IMX993 (SenSWIR InGaAs, GS) | Sony IMX990 (SenSWIR InGaAs, GS) | Sony IMX991 (SenSWIR InGaAs, GS) |
| Spectral Range | 400 – 1700 nm | 400 – 1700 nm | 400 – 1700 nm | 400 – 1700 nm |
| Resolution | 5.0 MP (2560 × 2048) | 3.0 MP (2048 × 1536) | 1.3 MP (1280 × 1024) | 0.33 MP (640 × 512) |
| Pixel Size (μm) | 3.45 × 3.45 | 3.45 × 3.45 | 5.0 × 5.0 | 5.0 × 5.0 |
| Sensor Format | 1/1.4" (8.94 × 7.09 mm) | 1/1.8" (7.07 × 5.30 mm) | 1/2" (6.40 × 5.12 mm) | 1/4" (3.20 × 2.56 mm) |
| A/D Conversion | 12-Bit / 8-Bit | 12-Bit / 8-Bit | 12-Bit / 8-Bit | 12-Bit / 8-Bit |
| Frame Rate (USB3 8-bit) | 61.9 fps @ full 135.7 fps @ 1280×1024 | 93 fps @ full 176 fps @ 1024×768 | 200 fps @ full 392 fps @ 640×512 | 400 fps @ full 753 fps @ 320×256 |
| Frame Rate (10G 8-bit) | 165 fps @ full 322 fps @ 1280×1024 | 220 fps @ full 415 fps @ 1024×768 | 90 fps @ full 253 fps @ 640×512 | — |
| Dynamic Range (HCG) | 51.5 dB | 51.5 dB | 58.7 dB | 58.7 dB |
| Full Well Capacity | 41.4 ke⁻ (HCG) / 69.9 ke⁻ (LCG) | 41.4 ke⁻ (HCG) / 69.9 ke⁻ (LCG) | 181.6 ke⁻ | 173.2 ke⁻ |
| Conversion Gain | 10.3 e⁻/ADU (HCG) 17.3 e⁻/ADU (LCG) | 10.3 e⁻/ADU (HCG) 17.3 e⁻/ADU (LCG) | 44.3 e⁻/ADU (KMA) 42.8 e⁻/ADU (KMB) | 42.3 e⁻/ADU (KMA) 43.0 e⁻/ADU (KMB) |
| Peak Quantum Efficiency | ~80% (Sony SenSWIR) | ~80% (Sony SenSWIR) | ~80% (Sony SenSWIR) | ~80% (Sony SenSWIR) |
| Dark Current | Low (SenSWIR) | Low (SenSWIR) | 383 e⁻/s @ 0°C 638 e⁻/s @ 20°C | 383 e⁻/s @ 0°C 638 e⁻/s @ 20°C |
| Exposure Range | 15 μs – 60 s | 15 μs – 60 s | 15 μs – 60 s | 15 μs – 60 s |
| Shutter | Global Shutter | Global Shutter | Global Shutter | Global Shutter |
| Binning | SW 2×2, 3×3, 4×4 | SW 2×2, 3×3, 4×4 | SW 2×2, 3×3, 4×4 | SW 2×2, 3×3, 4×4 |
| Cooling (KMA) | Built-in TEC: 25°C below ambient | Built-in TEC: 25°C below ambient | Built-in TEC: 25°C below ambient | Built-in TEC: 25°C below ambient |
| Cooling (KMB) | External TEC: 10°C below ambient | External TEC: 10°C below ambient | External TEC: 10°C below ambient | External TEC: 10°C below ambient |
| Available Interfaces | USB3 / 10GigE / CameraLink / CXP / UMV | USB3 / 10GigE / CameraLink / CXP / UMV | USB3 / GigE / CameraLink / CXP / UMV | USB3 / GigE / CameraLink / CXP / UMV |
| Digital I/O | 1× opto-isolated IN, 1× opto-isolated OUT, 2× non-isolated I/O | 1× opto-isolated IN, 1× opto-isolated OUT, 2× non-isolated I/O | 1× opto-isolated IN, 1× opto-isolated OUT, 2× non-isolated I/O | 1× opto-isolated IN, 1× opto-isolated OUT, 2× non-isolated I/O |
| Body Size (standard) | 80 × 80 × 45.5 mm | 80 × 80 × 45.5 mm | 80 × 80 × 45.5 mm | 80 × 80 × 45.5 mm |
| Body Size (UMV) | 33 × 33 × 38 mm (70 g) | 33 × 33 × 38 mm (70 g) | 33 × 33 × 38 mm (70 g) | 33 × 33 × 38 mm (70 g) |
| Lens Mount | C-mount | C-mount | C-mount | C-mount |
| Power | USB3 bus / DC 12V adapter | USB3 bus / DC 12V adapter | USB3 bus / DC 12V adapter | USB3 bus / DC 12V adapter |
| Software / OS | ToupView, SDK (C/C++/C#/Python) Win / Linux / macOS / Android | ToupView, SDK Win / Linux / macOS / Android | ToupView, SDK Win / Linux / macOS / Android | ToupView, SDK Win / Linux / macOS / Android |
Use Cases
SWIR cameras go where visible-light cameras cannot — penetrating materials, detecting moisture, and imaging in total darkness.
Image fluorescent probes in the 900–1700 nm second near-infrared window through deep biological tissue with minimal scattering and autofluorescence.
900 nm Series (SWIR1302 / SWIR331)
SWIR penetrates silicon wafers and ceramic substrates, enabling non-destructive inspection of ICs, die bonding, and back-end-of-line process defects.
400 nm Series (SWIR5000 / SWIR3000) · BSM System
Water absorbs strongly at ~1450 nm. Detect moisture in agricultural products, food packaging, and pharmaceutical blister packs non-invasively.
400 nm Series (all models)
Observe J-band (1100–1400 nm) and H-band (1500–1800 nm) targets with built-in IR bandpass filters suppressing visible Hα emission.
400 nm Series (SWIR1300 / SWIR5000)
UMV variants (33×33×38 mm, 70 g) provide full SWIR capability in a drone-deployable form factor for long-range observation and reconnaissance.
SWIR5000KMB-UMV / SWIR3000KMB-UMV / SWIR330KMB-UMV
Up to 1000 fps (CameraLink) enables real-time inspection of fast-moving products — surface defects, coating uniformity, and laser process monitoring.
400 nm Series (CL variants) · 900 nm SWIR331-CL1000
Expert Guidance
Tell us what you're imaging — tissue, semiconductors, food, astronomy, or something else. We've helped scientists and engineers across the Netherlands find the right SWIR solution.
No obligation. Preferably in your field and subject.